Dry and Plasma Etching

Yale’s cleanroom is equipped with multiple dry etchers and a wide variety of process gases.  It’s capable of etching metals, semiconductors, and organic films at controllable rates with high selectivity. The cleanroom is also capable of filling niche applications such as cryo and bosch deep silicon etching, oxygen surface cleaning, and xenon difluoride structure release.

The Oxford 100 and DRIE both require four inch wafers. When etching smaller samples it is recommended to mount samples to a four inch carrier wafer. The cleanroom supplies Crystalbond 555-HMP for this purpose, but photoresist, Santovac 5, and AIT Cool-Grease are all acceptable alternatives.

For wet etching capabilities, see the wet chemistry hoods.