Oxford 80+ ICP RIE | Yale University Cleanroom

Quick Info

Summary

The Oxford Plasmalab 80 Plus Inductively Coupled Plasma Reactive Ion Etcher (ICP RIE) provides etching capability for superconductors and select other “clean” materials. It uses fluorine chemistry along with oxygen and argon to etch films on the nanometer to micron scale. This open load system has a two inch graphite clamp for use with helium backside cooling, as well as replaceable quartz and graphite platens for different etch chemistries.

Details

Tool Owner:

Yong Sun

Internal Rate:

$64.00/Hour

Gas Selection: O2, SF6, CF4, CHF3, Ar
Coil and Bias Powers: 600 W and 600 W
Allowed Materials*: Si, SiO, SiN, Nb, NbN, Ta, Ge, Positive resist, PMMA
Banned Materials*: Au, Ag, Pt, Cu, Most other materials.

*Due to the ever-changing nature of research, and the sensitive nature of the equipment these lists are incomplete. Please contact a staff member to discuss etch plans before attempting to etch a new material.

User Guide:

Video