Oxford 100 ICP RIE | Yale University Cleanroom

Quick Info

Summary

The Oxford 100 is critical to several research applications at Yale. It has the largest variety of etch gases available and can handle the largest variety of research samples, including III-V materials, semiconductors, and select metals. This load locked system requires samples to either be 4 inch wafers, or mounted on 4 inch wafers. In addition to deep silicon etching, this system is also capable of etching a limited selection of dielectrics and other materials.

Details

Tool Owner:

Yong Sun

Internal Rate:

$64.00/Hour

Gas Selection: Cl2, BCl3, CH4, SF6, CHF3, CF4, O2, Ar, H2
Coil and Bias Powers: 600 W and 3000 W
Compatible Materials*: Si, SiO, SiN, GaAs, GaN, Al, AlN, AlO, LiNbO, InP, Parylene, HBN, FTO, MoS2, Carbon, Ni, SiC, +PR, -PR, PMMA
Banned Materials*: Au, Ag, Pt, Cu, Magnetics

*Due to the ever-changing nature of research, and the sensitive nature of the equipment these lists are incomplete. Please contact a staff member to discuss etch plans before attempting to introduce a new material to the system.

User Guide:

Video