Oxford Cryo Bosch DRIE | Yale University Cleanroom

Quick Info

Summary

The Oxford Cryo Bosch Deep Reactive Ion Etcher (DRIE) is a specialized ICP RIE etcher. It can perform high aspect ratio etches in silicon on the scale of hundreds of microns. It accomplishes this using either the bosch multiplex process or the cryogenic etch process. Common applications for this tool involve microfluidics, PDMS mold development, and MEMS applications. This load locked system requires samples to either be 4 inch wafers, or mounted on 4 inch wafers. In addition to deep silicon etching, this system is also capable of etching a limited selection of dielectrics and other materials.

Details

Tool Owner:

Yong Sun

Internal Rate:

$64.00/Hour

Gas Selection: O2, SF6, C4F8, Ar, CF4, CHF3
Coil and Bias Powers: 600 W and 3000 W
Allowed Materials*: Si, SiO, SiN, Al, Al2O3, AlN, Ni, Cr, Positive resist, PMMA
Banned Materials*: Most other materials.

*Due to the ever-changing nature of research, and the sensitive nature of the equipment these lists are incomplete. Please contact a staff member to discuss etch plans before attempting to etch a new material.

User Guide:

Video